| Paper: | MO-SP.2P.7 |
| Session: | Terahertz Antennas, Interconnects and Systems |
| Location: | Grand Atlantic Salon II |
| Session Time: | Monday, June 27, 13:20 - 16:40 |
| Presentation Time: | Monday, June 27, 15:40 - 16:00 |
| Presentation: |
Special Session Oral
|
| Paper Title: |
Characterization of Flip-chip Interconnect for mm-wave System in Package Applications |
| Authors: |
Saman Jafarlou, University of California, Irvine, United States; Mohammad Fakharzadeh, Sharif University of Technology, Iran; Behzad Biglarbegian, SiBeam, United States; Mihai Tazlauanu, Peraso Tech Inc, United States |
