Paper: | MO-SP.2P.7 |
Session: | Terahertz Antennas, Interconnects and Systems |
Location: | Grand Atlantic Salon II |
Session Time: | Monday, June 27, 13:20 - 16:40 |
Presentation Time: | Monday, June 27, 15:40 - 16:00 |
Presentation: |
Special Session Oral
|
Paper Title: |
Characterization of Flip-chip Interconnect for mm-wave System in Package Applications |
Authors: |
Saman Jafarlou, University of California, Irvine, United States; Mohammad Fakharzadeh, Sharif University of Technology, Iran; Behzad Biglarbegian, SiBeam, United States; Mihai Tazlauanu, Peraso Tech Inc, United States |