Technical Program

Paper Detail

Paper:MO-SP.2P.7
Session:Terahertz Antennas, Interconnects and Systems
Location:Grand Atlantic Salon II
Session Time:Monday, June 27, 13:20 - 16:40
Presentation Time:Monday, June 27, 15:40 - 16:00
Presentation: Special Session Oral
Paper Title: Characterization of Flip-chip Interconnect for mm-wave System in Package Applications
Authors: Saman Jafarlou, University of California, Irvine, United States; Mohammad Fakharzadeh, Sharif University of Technology, Iran; Behzad Biglarbegian, SiBeam, United States; Mihai Tazlauanu, Peraso Tech Inc, United States

AP-S/URSI 2016 Patrons